Our group focuses on the development of low-power electronic devices by engineering heterogeneous device platforms and transformative materials, with an emphasis on controlling charge, heat, and spin transport at their interfaces. From an application standpoint, we are excited to contribute to next-generation AI hardware, novel interconnects, and new thermal strategies for energy-efficient, 3D-integrated electronic systems. We are also highly interested in leveraging AI/ML for accelerated design of experiments and physics-informed modeling to enhance our understanding and optimization of materials and devices at multiple scales. These efforts and innovations will complement software and circuit design efforts, driving collaboration and multiplying energy-efficiency gains across computing hardware.

We are a highly interdisciplinary group and welcome energetic and highly motivated scientists and engineers who are passionate about scientific innovation and technological leadership. Our group is committed to an engaging, supportive, and inclusive workplace, and we are open to new perspectives, experiences, and approaches.