Areas of Interest:
(i) Nanofabrication and characterization of emerging memory devices (spin and ferroelectric devices), (ii) Synthesis, electronic, and spin transport of topological materials. (iii) Wide and Ultrawide Bandgap Device Fabrication and Characterization (iv) Nano and micro-scale heat transfer, thermal characterization, heat management, and nanofabrication,
Our group focuses on the development of low-power electronic devices by engineering heterogeneous device platforms and transformative materials, with a particular emphasis on controlling charge, heat, and spin transport at their interfaces. We are especially excited to contribute to next-generation AI hardware on both rigid and flexible substrates, and to explore novel interconnects and new thermal strategies for energy-efficient, 3D-integrated electronic systems. We are also interested in leveraging machine learning for accelerated design of experiments, materials discovery, and physics-informed modeling, to enhance our understanding and optimization of materials and devices at multiple scales. These efforts and innovations will complement software and circuit design efforts, driving collaboration and multiplying energy-efficiency gains across computing hardware.